Aeva has announced the development of a new high-power semiconductor optical amplifier (SOA) that delivers industry-leading performance for next-generation AI data centers and advanced FMCW LiDAR applications. As AI workloads scale rapidly, data centers are grappling with power efficiency, thermal constraints, and the need to transmit massive volumes of data, accelerating adoption of high-efficiency optical technologies that support architectures such as co-packaged optics (CPO), ELSFP, and high-bandwidth parallel optics. Aeva’s new SOA extends the company’s vertically integrated photonics platform beyond sensing, opening opportunities in AI infrastructure, Physical AI, and autonomous systems. Manufactured in modern semiconductor fabs, the SOA is designed for high yield, reliability, long-term stability, and cost-effective scalability.
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“As AI infrastructure and autonomous systems continue to scale, the industry needs optical technologies that can deliver high performance without compromising efficiency, manufacturability, reliability, or cost,” said Pradeep Srinivasan, VP of Photonics at Aeva. “This new high-power SOA reflects Aeva’s deep expertise in photonics and semiconductor design and has the potential to enable a new class of scalable architectures across both AI data centers and FMCW LiDAR applications for automotive and Physical AI applications.” Technically, the amplifier delivers over 28 dBm of optical output power with wall-plug efficiencies exceeding 20% at temperatures up to 50°C, enabling lower system power dissipation, reduced costs, and improved reliability across large-scale AI data center deployments and multi-beam FMCW LiDAR systems.