ADLINK Technology Inc. is a leader in edge AI computing and embedded systems. They have launched the new Express-PTL COM Express module. This module runs on Intel’s Core Ultra Series 3 processors. It offers next-generation performance and AI features for embedded computing. Set for release in Q2 2026, this new module uses Intel’s hybrid processor design. It has strong CPU cores, a powerful integrated GPU, and NPU acceleration. This setup offers up to 180 trillion operations per second (TOPS) for AI tasks. Plus, it’s compact and rugged.
ADLINK is launching its first COM Express module. It features Intel’s latest processor. It significantly boosts performance, energy efficiency, and versatility.
This is exciting news for:
Embedded computing
Industrial automation
Robotics
Medical imaging
Other challenging applications
What’s New: Express-PTL’s Capabilities
ADLINK’s new Express-PTL module features Intel Core Ultra Series 3 processors. It includes a strong Intel Arc GPU with up to 12 cores. It features an Intel NPU 5.0, providing up to 50 TOPS for AI tasks. Combined with its built-in CPU resources, it achieves an impressive 180 TOPS for AI computing. It is ideal for handling complex inference tasks at the edge.
Key features include:
This hybrid CPU features up to 16 cores. It combines high-performance P cores with efficient E cores, balancing speed and power.
Intel Arc GPU offers up to 120 TOPS. This boosts AI and graphics performance in vision, imaging, and visualization.
Offers up to 128 GB of DDR5 memory. It includes error correction for dependable performance and reliability.
Industrial-grade ruggedization for extreme temperatures (–40°C to 85°C) meets mission-critical standards. This is ideal for automation, transportation, and harsh environments.
Advanced connectivity with high-bandwidth PCIe interfaces and support for modern I/O options.
ADLINK will expand its lineup in 2026. Along with Express-PTL, it will add COM-HPC-mPTL, SBC35-PTL, and MXE-330 modules. All will use Intel Core Ultra Series 3 processors. These provide tailored solutions for tight spaces and autonomous systems.
Why This Matters to the Semiconductors & Electronics Industry
This new, high-performance COM Express module shows important trends in the Semiconductors & Electronics sector. Embedded AI is becoming a central part of modern computing systems.
1. Accelerated Edge AI Adoption
As AI workloads spread from data centers to edge and embedded systems, the need for modules that can perform high-speed inference locally is growing fast. These modules don’t need cloud connectivity.
The Express-PTL combines a CPU, GPU, and NPU to provide strong computing power. This makes it great for real-time AI tasks like:
Computer vision
Robotics navigation
Advanced analytics
Medical image processing
Autonomous machine control
It’s built for efficiency in these areas.
This directly supports broader industry trends toward intelligence at the edge.
2. Enhanced Performance and Lower System Complexity
In the past, achieving high performance in embedded systems required separate processors, GPUs, and AI accelerators. This approach added complexity, cost, and power use. ADLINK merges these functions into a single standards-based COM Express module. This simplifies design and helps semiconductor integrators and OEMs get to market faster.
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3. Rugged and Industrial Capability
ADLINK designed the Express-PTL to work in extreme temperatures. It also supports key industrial features like in-band ECC memory, Time-Sensitive Networking (TSN), and strong thermal management. This shows how embedded electronics are evolving for mission-critical uses outside controlled settings. This shows a wider industry need for semiconductors and modules. They must work reliably in tough conditions, like factory floors and outdoor autonomous systems.
4. Supporting System-Level Innovation
The Express-PTL and its successors will build the next generation of products.
These include:
Autonomous mobile robots (AMRs)
Smart transportation systems
Industrial automation
Advanced medical devices
All these markets rely on high-performance, reliable semiconductors and embedded electronics. ADLINK’s new platform boosts AI throughput and provides flexible I/O. This sparks system-level innovation and helps create unique products.
Broad Impacts on Businesses in the Sector
ADLINK’s release of the Intel Core Ultra Series 3 COM Express module will impact many businesses in the semiconductor and embedded systems fields in various ways:
Faster Product Development and Deployment
Companies in automation, automotive, healthcare, and consumer robotics will gain from AI-enabled embedded systems that are easy to integrate. These modules help cut down development cycles. Developers can use standardized COM Express platforms instead of making custom boards with separate parts. This approach speeds up both prototyping and production.
Lower Total Cost of Ownership
Integrated modules can reduce the number of separate components and simplify supply chains. OEMs can use built-in AI and graphics performance. This helps them skip the costs and hassle of getting external GPUs or accelerators. As a result, they can reduce system costs and long-term maintenance.
Competitive Differentiation Through Embedded Intelligence
Businesses using high-performance embedded AI platforms can offer smarter and more responsive products. Autonomous systems can quickly respond to sensory inputs. Industrial devices can do predictive maintenance on-site. Medical equipment can gain insights from imaging data without needing outside servers. These features offer key advantages in competitive markets.
Expanding into New Markets
The sturdy design and industrial features create chances in areas like defense, aviation, energy, and transportation. These industries need strong computing power and dependable hardware for long-lasting use.
Conclusion
ADLINK’s new COM Express module uses Intel Core Ultra Series 3 processors. This marks a big leap in embedded AI and edge computing. It aligns with key trends in Semiconductors & Electronics. These trends include performance consolidation, AI acceleration, industrial ruggedness, and modular design. This platform helps businesses innovate quickly. It lowers system costs and creates strong new products in AI-driven markets.