Silicon Labs, the leading innovator in low-power wireless solutions, announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices.
As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been greater. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs’ Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications.
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“Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency,” said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. “With the SiXG301 and upcoming SiXG302 families, we’re delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they’re plugged in or running on battery power.”
The SiXG301 and SiXG302 families will initially include “M” devices for multiprotocol, the SiMG301 and SiMG302, and “B” devices optimized for Bluetooth LE communications, the SiBG301 and SiBG302.
SOURCE: PRNewswire