Qualcomm Technologies, Inc., unveiled the Qualcomm® FastConnect™ 7900 Mobile Connectivity system, the first to deliver AI-optimized performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip. Utilizing AI, FastConnect 7900 adapts to specific use cases and environments, delivering meaningful optimizations across power consumption, network latency and throughput. FastConnect 7900 integrates Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding to create a powerful suite of proximity technologies that enable security rich device discovery, access, and control.
Adding to its technical prowess, FastConnect 7900 leverages a new class of RF front-end modules, and next-generation implementation of High Band Simultaneous technology, a key Wi-Fi 7 era innovation at the heart of multi-device experiences and foundational to Qualcomm® Expanded Personal Area Network (XPAN) and Snapdragon Seamless experiences.
“FastConnect 7900 is a technological feat, leveraging AI to raise the bar and deliver leading Wi-Fi 7 and Bluetooth capabilities while integrating Ultra Wideband all on a single 6nm chip,” said Javier del Prado, vice president and general manager for mobile connectivity, Qualcomm Technologies, Inc. “Building on the legacy of our first-gen Wi-Fi 7 offering found in millions of devices today, FastConnect 7900 creates a new way to connect. The system brings next-level capabilities across AI, proximity, and multi-device experiences into the devices we love most.”
Highlights:
- Qualcomm FastConnect 7900 leverages AI to set a new bar for high-performance, low latency and low-power connectivity.
- FastConnect 7900 is the first to integrate Wi-Fi, Bluetooth, and Ultra Wideband technologies on a single chip, for seamless proximity experiences such as digital key, object finding and indoor navigation.
- FastConnect 7900 is expected to launch commercially in the second half of 2024.
SOURCE : qualcomm