Digi International, a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, extended its IoT solution portfolio with the unveiling of its new Digi ConnectCore MP1 family of system-on-modules (SOMs). The MP1 is the industry’s smallest STM32MP1 SOM that integrates Wi-Fi, Bluetooth and wired connectivity without comprising design flexibility.
“Digi ConnectCore MP1 SOMs respond to the challenge of building intelligent, connected and secure wireless products in strongly regulated markets such as the healthcare, transportation, and industrial sectors”
This solution is made complete with its Connected Device platform as well as its well-tested development tools and design support. This makes Digi ConnectCore MP1 SOMs a cost-effective wireless solution for original equipment manufacturers (OEMs) seeking to reduce risk and effort in their product development. Ideal Digi ConnectCore MP1 applications include handheld products with cameras and/or displays such as medical devices, environmental test equipment, industrial human machine interfaces, or headless devices such as EV charging stations, renewable-energy controllers and others.
Leveraging both new and market-proven STM32MP1 micro processing units (MPUs) from STMicroelectronics (STM), Digi ConnectCore MP1 SOMs offer more features with a lower total cost of ownership. The form factor is smaller than a postage stamp (29×29 mm), which is ideal for form-factor-challenged applications with low-profile requirements. These off-the-shelf family of Digi ConnectCore MP1 SOMs bring scalability, compatibility and pre-certified wireless connectivity in a solution suitable for a broad range of applications in the healthcare, transportation and industrial sectors.
The unique Digi SMTplus™ surface-mount form factor provides design flexibility by enabling more complex applications through land grid array (LGA) pads and less complex applications using edge-castellated pads. By eliminating the need for connectors, ConnectCore SOMs shrink the bill of materials and offer greater suitability for high-vibration and harsh environment applications where connectors are prohibitive.