DesignCon, the premier high-speed communications and system design event, offers industry-critical engineering solutions in the digital world. As a global leader in interconnect solutions, BizLink is committed to developing flexible, stable, and efficient data center connectivity solutions. This year BizLink is excited to showcase its latest interconnect solutions in two themed booths (1154 and 1448) at DesignCon 2022 in Santa Clara, CA from April 6 to 7. In booth 1154, BizLink will exhibit its advanced data center interconnects such as 800G ACCs/DACs, 400G AOCs, and 800G loopback test adapters. In addition to this, BizLink will showcase its PCIe 5/6 internal cables, power whips, DC cables, high-power connectors, optical interconnect solutions, and DP80/USB4 EPR high-speed cables in booth 1448.
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BizLink’s industry-leading high-speed cable technology enables it to provide superior point-to-point solutions up to 800 Gbps for state-of-the-art data center applications. Its advanced data center interconnect solutions include 800G ACCs/DACs, 400G AOCs, and 800G loopback test adapters. With sufficient inhouse design capabilities of printed circuit boards, connectors, and bulk cables, BizLink can provide customers with cutting-edge data center interconnect solutions.
BizLink’s industry-leading high-speed cable technology enables it to provide superior point-to-point solutions up to 800 Gbps for state-of-the-art data center applications. Its advanced data center interconnect solutions include 800G ACCs/DACs, 400G AOCs, and 800G loopback test adapters. With sufficient inhouse design capabilities of printed circuit boards, connectors, and bulk cables, BizLink can provide customers with cutting-edge data center interconnect solutions.
BizLink’s industry-leading high-speed cable technology enables it to provide superior point-to-point solutions up to 800 Gbps for state-of-the-art data center applications. With sufficient inhouse design capabilities of printed circuit boards, connectors, and bulk cables, BizLink can provide customers with cutting-edge data center interconnect solutions and turn their innovative ideas into reality. Its global production footprint and high-performance RF laboratories can assure a constantly high-quality output worldwide.
As all kinds of high-speed applications are boosting in the cloud, such as AI, 5G, and cloud computing, the fast evolution of the PCIe specifications is an inevitable trend. BizLink is expecting that PCIe 5.0 will enter a ramp-up phase with significant demand for high-speed connections from this year. In response to this trend, BizLink develops innovative PCIe interconnect solutions with different form factors, including MCIO and SFF-TA-1002 (Gen-Z), to fulfill the PCIe 5.0 32GT/s NRZ high-speed data rates for the internal connections of data centers. Furthermore, along with the PCIe 6.0 base specifications announced in January this year, BizLink proudly provides customers its passive 1m PCIe 6.0 64GT/s PAM4 internal cable solutions for the early evaluation and development of new interconnect architectures and applications.