Molex has enhanced its range of HSAutoLink Interconnect products through the introduction of the HSAutoLink G Connector System. This is an advanced automotive connectivity product, which is specifically developed for the Software-Defined Vehicles (SDVs) to allow for Ethernet data speeds of up to 25Gbps. The demand for high bandwidths from ADAS, radar, LiDAR, zonal architectures, immersive displays, and centralized computing systems has been taken care of through HSAutoLink G. “As the automotive industry transitions to Software-Defined Vehicles (SDVs), automakers must overcome major performance bottlenecks while ensuring the highest levels of reliable connectivity,” said Min Kong, regional general manager, Connected Mobility Systems (CMS), Molex. “The HSAutoLink family has been a trusted backbone for vehicle architectures for nearly two decades. Building on that legacy, the new HSAutoLink G system gives OEMs a field-proven upgrade path, improving supply chain flexibility and resiliency for faster time to market.”
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The connector system incorporates advanced electromagnetic interference shielding, controlled differential impedance, anti-stubbing protection, and enhanced grounding to ensure signal integrity and reliability in demanding automotive environments. Supporting standardized USCAR footprints, the portfolio offers sourcing flexibility for OEMs and tier-one suppliers while leveraging Molex’s global manufacturing capabilities. With product samples now available, HSAutoLink G extends Molex’s automotive connectivity leadership by enabling high-speed, resilient communication infrastructure for next-generation autonomous and software-defined vehicle platforms.