Adeia Inc. has just declared the extension and upgrade of its intellectual property (IP) licensing contract with United Microelectronics Corporation (UMC). The last agreement upgrade guarantees that UMC is still going to have the right to use Adeia’s semiconductor technology collection (including hybrid bonding breakthroughs) and, at the same time, it extends the partnership between the two companies in the area of 3D integration and advanced semiconductor packaging technologies of future generations.
The newly done partnership corresponds to the rising industry call for high-performance chip architectures and advanced manufacturing techniques. In accordance with the accord, UMC will resort to Adeia’s semiconductor IP portfolio for innovating its advanced packaging capabilities and offering flexible integration options for semiconductor applications of the future.
“The industry is seeing growing demand for chiplet architectures, driven by AI but also across diverse applications from networking to automotive. Leveraging our partnership with Adeia, UMC has unlocked significant value for customers through the successful 3D integration of RFSOI wafers for RF front-end modules,” said Steven Hsu, Vice President of Technology Development at UMC. “UMC is pleased to deepen this collaboration as we expand our advanced packaging services, providing customers with greater flexibility to integrate different types of wafers to meet the evolving needs of next-generation applications.”
Also Read: GlobalFoundries Introduces AutoPro 150 eMRAM Technology for Automotive
Supporting the Next Wave of Semiconductor Innovation
Adeia’s semiconductor IP portfolio features major advancements in hybrid bonding, advanced packaging, and semiconductor processing technology. These technologies allow for tighter interconnect pitch, increased energy efficiency, higher bandwidth, and reliability—features that are becoming increasingly critical to AI processors, high-performance computing systems, advanced logic and memory devices, etc.
With these technologies being integrated into its manufacturing and packaging services, UMC is well-positioned to enable its customers to speed up the development of advanced chip architectures required for emerging applications in AI, networking infrastructure, automotive electronics, and other high-growth areas.
“We are pleased to expand and extend our partnership with UMC, a respected leader in semiconductor manufacturing,” said Mark Kokes, chief revenue officer of Adeia. “Our innovations in hybrid bonding and advanced interconnect technologies are helping shape the future of semiconductors. This agreement reflects the strength of our IP portfolio and our commitment to supporting UMC as they continue to drive advancements in 3D integration and heterogeneous packaging.”
A Legacy of Semiconductor Innovation
Adeia has been focused for more than 30 years on developing structural, process, and materials innovations that underpin the entire modern semiconductor design and manufacturing industry. Its intellectual property is licensed worldwide in the semiconductor ecosystem, and it still powers higher density, higher efficiency, and higher performance chip architectures for the next generation of electronic devices worldwide.
