STMicroelectronics has announced that it has initiated high-volume production of its advanced PIC100 silicon photonics platform, which is intended for high-speed optical interconnect solutions for hyperscalers in data centers and AI compute clusters. The PIC100 supports 800G and 1.6T optical transceivers, which will provide significantly increased speeds, lower latency, and greater energy efficiency in data centers to meet unprecedented speeds in data movement driven by AI compute applications. STMicroelectronics will be able to increase production speeds significantly by utilizing its 300mm production facilities, which will increase production by more than four times by 2027, driven by long-term production commitments from key customers.
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“Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said Fabio Gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.” Industry analysts also highlight the strong market outlook for optical interconnects, as growing AI infrastructure places increasing pressure on data center networking capacity. Looking ahead, ST is developing its next-generation PIC100 TSV platform, integrating through-silicon via technology to enhance optical connectivity density and support emerging architectures such as co-packaged and near-packaged optics.
