Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology, and United Microelectronics Corporation (UMC) have announced the full qualification and production release of SST’s embedded SuperFlash® Gen 4 (ESF4) with full Automotive Grade 1 (AG1) capability on UMC’s 28HPC+ foundry platform. Developed through close collaboration, the 28nm ESF4 solution delivers enhanced embedded non-volatile memory performance and proven reliability for automotive controllers, while significantly reducing masking steps compared to other 28nm HKMG eFlash offerings, resulting in cost and manufacturing efficiency advantages. The platform enables automotive customers currently using 40nm ESF3 AG1 solutions to scale to a more advanced node while meeting stringent industry requirements.
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“As automotive requirements accelerate, developers need solutions that drive efficiency, speed up time to market and satisfy stringent industry standards. To meet these needs, UMC and SST have delivered a robust 28nm AG1 solution which is now ready for the production of customer designs,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “UMC has been a valuable partner for SST and SuperFlash innovation, and the companies continue to jointly address the rapidly evolving market requirements and deliver technically and economically advanced offerings.” “As the automotive industry rapidly advances toward more connected, autonomous, and shared vehicles, the demand for highly reliable data storage and high-capacity data updates continues to grow. This has driven customer demand for scaling SuperFlash to the 28nm process,” said Steven Hsu, Vice President of Technology Development at UMC.