NewPhotonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, introduced NPC50503 1.6T NPO laser integrated transmitter with integrated OSPic™ all-optical signal processor. The NPC50503 NPO chiplet is the industry’s first laser-integrated 1.6T solution for a serviceable NPO environment at reduced power consumption and interoperability to meet the connectivity demands in today’s AI factory.
Designed for NPO serviceability architectures, the new NPC chiplet features integrated laser and the SmartPIC™ optical programmable photonic toolset enabling a performance boost equalizing electrical impairment and optimized for small form factor co-packaging next to GPU and AI accelerators.
The monolithic silicon photonic flip chip features enhanced link performance for compact, power-optimized scale-up and scale-out interconnect in hyperscaler data center AI factories.
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Key product features include:
- Heterogeneously integrated lasers with high coupling efficiency
- Low power flip chip BGA simplifying complex assembly steps
- 224 Gbps high-bandwidth PAM4 802.3dj compliant
- 8 dB RF link-budget improvement beyond the 21 dB long-channel baseline
- Per-channel output power monitoring and transmission disable access
- Reference design for RF/Optical integration
“As AI systems push 200Gbps/lane and beyond, power efficiency, signal integrity, serviceability and operational control become imperative,” said Doron Tal, SVP & GM of NewPhotonics.
“Our NPC50503 chiplet solution moves all the advanced optical domain advantages of our award-winning pluggable chip innovation directly adjacent to compute. This brings much needed NPO power efficiency in a modular and serviceable co-packaged answer to today’s system scalability and performance challenges.”
SOURCE: PRNewswire