MediaTek, a leading semiconductor firm, and DENSO Corporation, a prominent automotive component maker, are collaborating with each other. They will jointly develop customer-specific automotive SoC solutions. These solutions are designed for ADAS as well as new cockpit applications. The two companies will leverage the AI silicon expertise of MediaTek and the long experience of DENSO in the automotive industry. This will allow global automakers and Tier 1 suppliers to develop scalable and production-ready platforms quickly.
The combined effort from all these players in SoC strives to create silicon that can fulfill safety and reliability standards in the automotive segment. This includes adherence to functional safety standards as per ISO 26262 standards with an objective of meeting ASIL B and ASIL D levels of safety in functional safety requirements. Apart from this, this includes AEC-Q100 qualification standards in the automotive segment. All these measures help in building reliability in real-world environments. MediaTek’s sophisticated compute solution has accelerators in AI and image processing engines. These are combined with DENSO safety design expertise.
Why This Collaboration is So Important
The automotive segment is undergoing a rapid transformation. Cars are moving from being simple machines to smart platforms. They now contain features like AI, perception, and safety. MediaTek and DENSO’s collaboration is a strategic shift towards integrated automotive SoC platforms. The automotive SoC platforms support features like automotive level processing, power, functional safety, and scalability. Conventional automotive electronics may find it difficult to achieve the same.
1. Driving Next-Generation Safety and Automation
The ADAS functions, like adaptive cruise control and lane-keeping assistance, are based on real-time data processing. These functions are enabled by cameras, radar sensors, and lidar for automated braking in emergencies and multi-sensor perception. The SoC being built is expected to provide robust AI compute processing for these functions. Thus, quicker and more precise object detection will be enabled. The ADAS functions will enable Level 3 (conditional) and Level 4 (high automation) solutions. These levels entail greater responsibility for driving functions by vehicles.
2. Functional Safety and Automotive Reliability
Automotive systems need silicon that is properly verified for functionality. The silicon needs to work well at various temperature ranges, be able to withstand various vibrations, and remain stable for long periods of time. The collaborative effort between the various SoC suppliers achieves a high level of quality demanded by automobile manufacturers. The collaborative effort focuses on ISO 26262 functional safety and AEC-Q100 qualifications. This is necessary for widespread use in consumer automotive products. Safety aspects, including “safety islands,” help repair errors in real time.
Also Read: HARMAN International Acquires ZF Group’s ADAS Unit
3. Consolidation of Compute and Perception
In conventional automobile electronics, there are various ECUs that control different activities. These activities range from perception to control, infotainment, and connectivity. The integration of a high-performance SoC will make possible the implementation of a centralized computing architecture. Such an architecture will make the overall system less complex and lighter. It will also increase the overall performance while making it easier to handle. Such an implementation will lead to software-defined vehicles. OTA updates and modularity will make it possible to implement new features after purchasing the vehicle. It generates continuous revenue streams as well as novel business models.
Impact on the Automotive Industry
Increasing Capability of OEM and Tier-1 Vendors
For the OEMs, the scalable & customizable SoC platform assists in the integration of enhanced AI, perception, & safety functionalities. This decreases dependence on the patchwork supply chain. OEMs can also distinguish themselves with the autonomous driving capabilities & cockpit solutions. There is also optimization with respect to the overall cost of ownership.
Tier-1 suppliers supply essential modules and software stacks. They receive one silicon base only. One silicon base helps in the support of multiple applications on various car platforms.
Fueling Innovation in Autonomous Mobility
With the growing requirement of advanced automation in the sector, high-performance computing is becoming an inevitable requirement. The collaboration allows MediaTek and DENSO to make available the CHIP technology necessary for heavy computations. Heavy computations involve multi-sensor fusion, AI perception, path planning, and decision logic. All these features are necessary in the self-driving capabilities expected in modern vehicles.
Reducing the Time
The collaboration between MediaTek and DENSO provides ready-to-use IP blocks, safety work products, reference designs, and software tool chains. All the above are aligned with standards such as AUTOSAR Adaptive and Classic. This helps reduce design cycle variations as well as engineering risks. This enhances faster development time. This helps the OEM respond faster to changes in regulatory and market requirements. This also facilitates faster deployment of new ADAS functionalities.
Enhancing the Automotive Ecosystem
The alliance represents a bigger trend. The firms that manufacture semiconductors typically target the mobile industry. They are presently branching out into the automotive sector. MediaTek’s AI solutions and the ability to save energy suit DENSO’s emphasis on automotive systems and safety. The alliance benefits software developers, middleware suppliers, sensor suppliers, or safety solu- tions suppliers.
Impact of the Business on Automotive Stakeholders
Automotive Original Equipment Manufacturers & Mobility Platforms: The OEMs will benefit from the improved ADAS and cockpit solutions. Development time will decrease, and the cost of integration will lower. A functionally safe, AI-based SoC has improved safety, convenience, and user experience.
Tier-1 & Tier-2 Suppliers: Chip designers & System Engineers can share the same foundation. This ensures worldwide safety norms are easily fulfilled. The solution is not specifically designed for ADAS functions. Rather, it supports the next generation of Infotainment, Digital Clusters, and Vehicle-to-Everything Communication.
Start-ups and Software Innovators: The companies involved in the development of perception algorithms, sensor validation solutions, ADAS platforms, and AI models will have the advantage of the collective features of the SoC product. This leads to innovative products and distinguishes them in the market.
Providers of Sensors and Middleware: The companies providing cameras, radar, and lidar, as well as vehicle middleware, have to enhance their hardware and software components. It aims to be consistent with the new SoC architecture. It should lead to greater collaboration between the silicon, sensor, and software components.
Industry Trends and Practices Reiterated
The MediaTek-DENSO collaboration is evidence of several changes occurring in the Automotive market:
There is convergence between AI and the car electronics segment. There are challenges to be faced while designing chips to ensure the provision of AI performance, safety, and reliability.
OEMs start to produce vehicles with the help of compute platforms. The compute platforms contain flexible software stacks.
Cross-industry cooperation: Companies involved in the semiconductor industry and the traditional Tier 1 players in the automotive industry are working together. This is because they wish to live up to the Acceleration of self-driving and assisted driving functions: High level automation is aided by improved SoCs that facilitate better perception and decision-making.
Conclusion
MediaTek and DENSO are cooperating. They are developing customized silicon solutions specifically designed for ADAS in automotive applications. This collaboration marks an important step in the evolution of automobile technology. Their collaboration integrates high-performance computing expertise, artificial intelligence acceleration, functional safety solutions, and system reliability in a single semiconductor solution. This accelerates the development of smarter, safer, and smarter vehicles today and in the future. Automobile manufacturers and component providers are changing their strategies regarding SDVs, self-driving solutions, and software-driven vehicle platforms.