GigaDevice has introduced its latest high-performance dual-voltage xSPI NOR Flash lineup, the GD25NX series, designed with a 1.8 V core and 1.2 V I/O architecture to connect directly to 1.2 V SoCs without requiring an external booster circuit-reducing BOM cost and significantly lowering system power consumption. Building on its GD25NF and GD25NE products, the new series delivers the speed, stability, and efficiency required for applications including wearables, edge AI, data centers, and automotive electronics. Supporting an octal SPI interface with up to 200 MHz clock frequency in both STR and DTR modes, the GD25NX enables data throughput of up to 400 MB/s and delivers a 30% improvement in programming speed and a 10% reduction in erase time over conventional 1.8 V octal Flash.
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The devices integrate ECC, CRC, and DQS functionality for high data integrity and signal reliability in demanding SoC environments while reducing read power consumption by up to 50%. “The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash,” stated by Ruwei Su, GigaDevice Vice President and General Manager of Flash BU. “Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers.” Available in 64 Mb and 128 Mb densities with TFBGA24 and WLCSP packaging options, the GD25NX series is now sampling for customer evaluation.