Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced that it has been selected to be part of a team of microelectronic industry leaders, led by Microsoft, to build a chip development platform with the utmost regard for security as demonstrated by the DoD RAMP Project. Flex Logix was chosen for its leading embedded (eFPGA) technology that enables chips to be reconfigurable after tape-out, allowing companies to adapt to new requirements, changing standards and protocols as needed.
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“Security can mean a lot of different things. For eFPGA, it means providing a means for keeping circuitry secret by programming the eFPGA in a secure environment,” said Geoff Tate, CEO and Co-founder of Flex Logix. “We’re honored to be working with Microsoft to bring Flex Logix’s eFPGA technology as part of their Advanced Commercial Capabilities project for the DoD RAMP program.”
The RAMP project intends to address and replace the obsolete practices utilized by the United States Government in support of state-of-the-art custom IC and system-on-chip design especially those associated with physical or “back-end” design. Given the long system lifetime of DoD systems, utilizing eFPGA provides the capability to make silicon changes to update algorithms or modify functionality and saves money by avoiding costly tape-outs and installation of replacement parts.
“Our collaboration with Flex Logix will help to advance flexibility to chip design,” said Mujtaba Hamid, General Manager, Silicon, Modeling and Simulation, Microsoft. “The company’s eFPGA technology has demonstrated success in supporting mission-critical applications and we look forward to bringing this capability to support national security priorities.”
Using Flex Logix’s EFLX®, chip developers can implement eFPGA from a few thousand LUTs to hundreds of thousands of LUTs with performance and density per square millimeter similar to leading FPGA companies in the same process generation. EFLX eFPGA is modular so arrays can be spread throughout the chip, can have all-logic or be heavy-DSP, and can integrate RAM in an array of many types.