Tuesday, March 24, 2026
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UATP Partners with MICA to Bring Credential-less Multi-Tender Payment Solution

UATP, the global network that helps organizations simplify payments and expand their payment options, has partnered with credential-less payments infrastructure provider Mica to launch...

M-Cube and SOLUM Enter Partnership to Deliver Integrated Digital Signage and ESL Solutions for Retail Across Europe

M-Cube and SOLUM have entered into a strategic partnership through a Memorandum of Understanding (MoU) to deliver integrated Digital Signage and e-paper solutions for retail customers...

Ursa Major Appoints Chris Spagnoletti as Chief Executive Officer

Ursa Major has appointed Chris Spagnoletti as Chief Executive Officer. Spagnoletti brings more than 30 years of experience developing and delivering critical systems for...

Renesas Electronics Develops 3 nm TCAM for Automotive SoCs

Renesas Electronics Corporation, a global leader in the semiconductor industry, has recently issued a press release regarding its new 3 nanometer (nm) ternary content-addressable...

Draper Teams with NEMC to Advance Chip Design and Packaging Services

Draper and the Northeast Microelectronics Coalition (NEMC) have announced a new collaboration under which Draper will provide advisory services to startups and small companies...

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