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Marvell Joins Universal Chiplet Interconnect Express Consortium

Marvell announced that the company has joined the Universal Chiplet Interconnect Express (UCIe) Consortium as part of its ongoing development of open chiplet interconnect...

Mobile-first Communications Solutions to Empower Diverse Hybrid Workforces

Organizations have shifted to hybrid work models and adopted new mobile communications strategies due to the COVID-19 pandemic. Frost & Sullivan's recent analysis, Evaluating...

Owens Corning and Pultron Composites Form Joint Venture to Produce Fiberglass Rebar

Owens Corning and Pultron Composites announced that they have signed an agreement to create a joint venture to manufacture industry-leading fiberglass rebar. Also Read: Alkegen...

ECOM Launches Smarter Cocoa Charter to Empower Farmers and Drive Climate Resilience

ECOM – one of the world’s largest suppliers of cocoa beans and ingredients to leading chocolate manufacturers and consumer food brands – published its...

SK hynix to Supply Industry’s First HBM3 DRAM to NVIDIA

SK hynix Inc. (or "the company", www.skhynix.com) announced that it began mass production of HBM3, the world's best-performing DRAM. Also Read: Renesas to Acquire Reality...
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