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Figure Launches HELOC Wholesale Model to Further Expand Access to Untapped Equity and Ease Originator Experience

Figure Technologies Inc., a leader in transforming financial services through the power of blockchain technology, announced the launch of their wholesale lending platform, which...

DuPont and JetCool Announce Collaboration in Thermal Management for High-Power Electronics

DuPont and JetCool Technologies Inc., announced a collaboration to increase adoption of advanced liquid cooling technology, enabling thermal management for semiconductors, data centers and...

DigiKey Partners with GroupGets to Enable Hardware Startups to Bring Products to Market

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has partnered with GroupGets to...

Intel Plans Assembly and Test Facility in Poland

Intel today announced that it has selected an area near Wrocław, Poland, as the site of a new cutting-edge semiconductor assembly and test facility....

Hisense Middle East signs MoU with Condor Electronics for local manufacturing & assembly of consumer electronics for the MENA region

Hisense Middle East, one of the largest consumer electronics and home appliances manufacturer, has signed an official MoU with Condor Electronics, a part of...
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