Tuesday, September 8, 2026
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Semiconductor & Electronics

Renesas Introduces 3rd Generation DDR5 MRDIMM Chipset for High-Bandwidth AI Data Centers

Renesas Electronics has introduced its third-generation (Gen 3) DDR5 MRDIMM chipset solutions, delivering server-class memory speeds of up to 16,000 MT/s to address the...

Kioxia Introduces First PCIe® 6.0 Enterprise SSDs Utilizing Newest BiCS FLASH™ Generation 10 Flash Memory

Kioxia Corporation announced the KIOXIA CM10 Series of solid-state drives (SSDs), featuring the company's latest BiCS FLASH™ generation 10 TLC flash memory. Designed for...

ScaleFlux Unveils PCIe Gen6 SSD and CXL Memory Controllers

ScaleFlux will introduce two next-generation PCIe® Gen6 silicon solutions at Future of Memory and Storage (FMS) 2026: the FC6116 PCIe Gen6 NVMe SSD Controller and the MC600 PCIe Gen6 CXL® 3.2 Type...

Kioxia Commences Sample Shipments of 9th Generation BiCS FLASH™ 512Gb TLC Devices

KIOXIA America, Inc. announced it has commenced sample shipments of 512Gb Triple-Level Cell (TLC) memory devices incorporating its 9th generation BiCS FLASHTM 3D flash memory...

Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design

Qnity Electronics, a premier technology solutions leader across the semiconductor value chain, announced the launch of two new thermal interface materials (TIM): Laird™ Tflex™...

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