Wednesday, October 21, 2026
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Semiconductor & Electronics

Quectel Powers Global Connectivity and Flexible Deployment Models With New iSIM-Enabled Module

Quectel Wireless Solutions has launched the new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support. The iSIM...

Orolia Introduces New mRO-50 Ruggedized, a Robust Low SWaP-C Mini-Rubidium Oscillator

Orolia, the world leader in resilient positioning, navigation and timing (PNT) solutions and space-based atomic clocks, has introduced an upgraded edition of its low...

Anritsu and Tektronix Demonstrate PCI-Express 6.0 Base Specification Test System at PCI-SIG Developers Conference 2022

Anritsu Corporation President Hirokazu Hamada announces Anritsu is demonstrating its Signal Quality Analyzer-R MP1900A series as part of a PCI-Express® (PCIe®) 6.0 Base Specification...

Tagore Technology Introduces Family of Ultra-Low Noise Amplifiers and Linear PA Driver for 5G Infrastructure and High-Performance Receivers

Tagore Technology Inc., a pioneer of high-power GaN-based RF switches, today announced the introduction of Ultra-Low-Noise Amplifiers (LNA) and companion Linear Power Amplifier (PA)...

New Bluetooth LE Wireless MCUs Make High-Quality RF and Power Performance More Affordable

Texas Instruments (TI) expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth® Low Energy (LE) at half...

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