Tuesday, March 3, 2026
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Semiconductor & Electronics

AlixLabs AB Announced Completing Clean Room Hook Up of R&D Equipment for Atomic Layer Etch Pitch Splitting

AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in...

Denton Vacuum Wins Order for Infinity Biased Target Ion Beam Deposition System from Leading Laser Manufacturer

Denton Vacuum LLC announces it won a new system order for semiconductor laser facet coating from a leading laser manufacturer. The Infinity Biased Target...

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader in high speed,...

Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process

Addressing increasingly complex RFIC design requirements, Synopsys, Inc. announced a new RF design flow developed with Ansys and Keysight for the TSMC N6RF process,...

InnoPhase And Ingenic Create A Paradigm Shift By Enabling Video And AI For Wireless Battery-Based IoT Devices

InnoPhase, a fabless semiconductor company, specializing in extreme low power wireless IoT solutions, and Ingenic Semiconductor Co Ltd., a leader in microprocessors and CPU...

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