Saturday, February 28, 2026
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Semiconductor & Electronics

Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project

Integra Technologies Inc., the largest U.S. Outsourced Semiconductor Assembly and Test (OSAT) company, and Kansas Governor Laura Kelly jointly announced that the State of Kansas approved Integra's...

Dual Digital Interface, Multi-Channel LED Driver from Diodes Incorporated Addresses RGB and Single-Color Solid-State Lighting

Diodes Incorporated announces its latest linear current LED driver, the DIODES™ AL5887. This product offers a simple way of driving numerous LEDs to enable...

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation ,a leading global semiconductor foundry, and Cadence Design Systems, Inc. announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has...

Brigade Electronics to showcase its new sensor fusion system at CONEXPO-CON/AGG 2023

Brigade Fusion uses sensor fusion technology to combine Brigade's range of safety devices, including its 360-degree camera, radar obstacle detection and M2M RTLS (Real...

QuickLogic Partners with Andes Technology for eFPGA Joint Promotion

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced that it is partnering with Andes...

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