Tuesday, March 24, 2026
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Semiconductor & Electronics

Siemens Introduces Fuse EDA AI Agent for Semiconductor Automation

The announcement of the introduction of Siemens' Fuse EDA AI Agent, a next-generation autonomous solution with the ability to orchestrate complex semiconductor engineering design...

Supermicro Introduces BlueField-4 STX Storage Server for AI Inference

Supermicro has unveiled one of the industry’s first context memory (CMX) storage servers, built on NVIDIA’s newly introduced STX reference architecture, aimed at accelerating...

Cadence and NVIDIA Introduce Engineering Solutions for Agentic AI Chip and System Design

Cadence has expanded its collaboration with NVIDIA to advance its Design for AI and AI for Design strategy, introducing next-generation agentic AI solutions for...

Micross Components Appoints James J. Cannon as President and Chief Executive Officer

Micross Components, a global provider of high-reliability microelectronic products and services for aerospace, defense space, medical, and industrial applications, and a portfolio company of...

Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability

NHanced recently announced its collaboration with Avalanche Technology to manifest advanced solutions to the warfighter with the right combination of impactful capability and low...

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