Thursday, March 12, 2026
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Renesas Electronics Develops 3 nm TCAM for Automotive SoCs

Renesas Electronics Corporation, a global leader in the semiconductor industry, has recently issued a press release regarding its new 3 nanometer (nm) ternary content-addressable...

Draper Teams with NEMC to Advance Chip Design and Packaging Services

Draper and the Northeast Microelectronics Coalition (NEMC) have announced a new collaboration under which Draper will provide advisory services to startups and small companies...

CharterUP and HOLON Collaborate on Autonomous Shuttle Adoption

CharterUP, North America’s leading enterprise platform for group and shuttle transportation delivering AI-first, turnkey mobility solutions, announced a strategic partnership with HOLON, a provider...

Electra Joins Virginia Smart Airspace Program to Establish National Blueprint for Advanced Air Mobility

Electra announced a new partnership with the Virginia Advanced Air Mobility (AAM) Smart Airspace Program to design, implement, and test a first-of-its-kind, low-cost instrument...

Genomic Prediction Appoints Santiago Munné, Ph.D., as Chief Scientific Officer

Genomic Prediction, Inc., the frontrunner in advanced embryo screening, announced the appointment of Santiago Munné, Ph.D., as Chief Scientific Officer. A globally recognized leader...

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