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Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows,...

Avicena Works with TSMC to Enable PD Arrays for LightBundle™ MicroLED-Based Interconnects

Avicena, headquartered in Sunnyvale, CA, announced that the company will work with TSMC to optimize photodetector (PD) arrays for Avicena’s revolutionary LightBundle microLED-based interconnects....

Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration...

Marvell Announces Industry’s First 2nm Platform for Accelerated Infrastructure Silicon

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, is extending its collaboration with TSMC to develop the industry's first technology platform to...

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform Partner of the year awards for 2023. The OIP Partner...
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