Thursday, March 26, 2026
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semiconductor packaging

Adeia Expands Partnership with United Microelectronics Corporation

Adeia Inc. has just declared the extension and upgrade of its intellectual property (IP) licensing contract with United Microelectronics Corporation (UMC). The last agreement...

SkyWater Technology Chooses YES RapidCure for Fan-Out Wafer Packaging

YES ( Yield Engineering Systems, Inc. ), a leading manufacturer of process equipment for advanced semiconductor packaging, announced that SkyWater Technology has selected YES...
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