Wednesday, November 27, 2024
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semiconductor & electronics

AlixLabs AB Announced Completing Clean Room Hook Up of R&D Equipment for Atomic Layer Etch Pitch Splitting

AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in...

Denton Vacuum Wins Order for Infinity Biased Target Ion Beam Deposition System from Leading Laser Manufacturer

Denton Vacuum LLC announces it won a new system order for semiconductor laser facet coating from a leading laser manufacturer. The Infinity Biased Target...

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader in high speed,...

Valens Semiconductor’s Stello Chipsets to Power Crestron’s Next-Generation Product Lines

Valens Semiconductor, a premier provider of high-speed connectivity solutions for the audio-video and automotive markets, announced that a full suite of more than 24...

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA, Inc., the leading licensor of wireless connectivity, smart sensing technologies, and integrated IP solutions, announced that it has expanded its family of sensor...
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