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semiconductor & electronics

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation ,a leading global semiconductor foundry, and Cadence Design Systems, Inc. announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has...

Brigade Electronics to showcase its new sensor fusion system at CONEXPO-CON/AGG 2023

Brigade Fusion uses sensor fusion technology to combine Brigade's range of safety devices, including its 360-degree camera, radar obstacle detection and M2M RTLS (Real...

QuickLogic Partners with Andes Technology for eFPGA Joint Promotion

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced that it is partnering with Andes...

Microelectronics Commons Prototype Giving Much Needed Boost to American Microelectronics Industrial Base

The Office of the Under Secretary of Defense for Research and Engineering has proposed a prototype project to close the gap between microelectronics innovation...

Sony Electronics Announces Two 4K IP-Based Pan-Tilt-Zoom Cameras Featuring PTZ Auto Framing with AI Analytics

Sony Electronics is expanding its lineup of pan-tilt-zoom (PTZ) cameras with the addition of two 4K models with built-in AI analytics. The SRG-A40 and SRG-A12 cameras automatically and consistently track,...
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