Tuesday, October 1, 2024
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Semiconductor and electronics

First PCI Express 6.0 and CXL EDSFF Interposers

Teledyne LeCroy, the worldwide leader in protocol test solutions, announced availability of new PCI Express 6.0 EDSFF interposers, providing connectivity to Teledyne LeCroy's PCI...

Certus-NX-RT FPGA Completes Radiation Qualification and Shipping Flight Grade Units

Frontgrade, a leading provider of mission critical electronics for aerospace and defense, and Lattice Semiconductor Corporation , the low power programmable FPGA leader, successfully collaborated...

Industrial-Grade Silicon Carbide MOSFET from Diodes Incorporated Enables Higher Power Density

Diodes Incorporated introduces the latest addition to its portfolio of Silicon Carbide (SiC) products: the DMWS120H100SM4 N-channel SiC MOSFET. This device addresses demand for higher...

Read Magazine’s Weekly Roundup Featuring NASA, Carvana, Patriot’s, Nextracker and more!

Here is Read Magazine’s Weekly Roundup of the top news from global markets. In this fast-paced world, breaking down information helps readers grasp the...

DuPont Launches ULTRAFILL 6001 Dual Damascene Copper Plating Bath for Back End of Line (BEOL) Metallization in Semiconductor Fabrication

DuPont Electronics & Industrial announced its new ULTRAFILL 6001 dual damascene copper offering for semiconductor fabrication. This latest addition to the family of DuPont ULTRAFILL...
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