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Semiconductor and electronics

NEO Semiconductor Introduces Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips

NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet...

HARTING Americas Unveils Three New Product Lines to Drive Smart Factory Innovations

HARTING, the gold standard in connectivity for industrial environments and mission-critical applications, announced the launch of three new products designed to meet the evolving...

Chelsio Announces Broad Sampling of T7 DPU Platform

Chelsio Communications, a leading provider of high-performance (1/10/25/40/50/100/200/400Gb) Ethernet Unified Wire ASICs and Adapters for storage networking, virtualized enterprise data centers, cloud infrastructure, and...

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize PIC Device Testing with AI Solutions

Lightium AG, MPI Corporation, and Axiomatic_AI, have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic...

Mach42 Unveils Breakthrough AI Solution for Analog Circuit Analysis

Mach42 is redefining analog verification by combining proprietary AI algorithms, high-performance simulation engines, and scalable cloud infrastructure. Its Discovery Platform accelerates design space exploration, identifying out-of-spec...
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