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Semiconductor and electronics

NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics Chiplet Solution with Interoperability for 1.6T

NewPhotonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, introduced NPC50503 1.6T NPO laser integrated transmitter...

PlayNitride and Brillink Announce Strategic Collaboration to Advance Array-Based Photonic Interconnects

PlayNitride, a global leader in MicroLED technologies, announced a strategic collaboration with Brillink to develop a next-generation array-based photonic interconnect solution designed to deliver...

Read Magazine’s Weekly Roundup: Discover the Most Recent News Accenture, NVIDIA, Lockheed Martin, Toyota Motor, Databricks, Qualcomm and More !

Here is Read Magazine’s Weekly Roundup of the top news from global markets. In this fast-paced world, breaking down information helps readers grasp the...

Cadence Launches Chiplet Spec-to-Packaged Parts, AI, Data Center and HPC

Cadence Design Systems, a leading provider of electronic design automation (EDA) tools and semiconductor IP, announced a new partner ecosystem aimed at accelerating chiplet...

Innodisk and Qualcomm Partner on AI Dragonwing Computing Series

Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, marking the first product line...
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