Teledyne LeCroy, the worldwide leader in protocol test and measurement solutions, announced the support for IEEE 802.3ck based 100GbE four-level pulse amplitude modulation (PAM4)...
Apple announced M1 Ultra, the next giant leap for Apple silicon and the Mac®. Featuring UltraFusion™ — Apple’s innovative packaging architecture that interconnects the...
Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with global semiconductor leader Infineon Technologies Hong Kong Limited (Infineon) in a strategic co-incubation...
To support the growing semiconductor industry’s employment needs and welcome diverse talent into the technical workforce, Maricopa Community Colleges and Intel Corporation have announced...
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that Qualcomm Technologies, Inc. has validated Samsung's 14-nanometer (nm) based 16-gigabit (Gb)...
