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Microelectronics

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation ,a leading global semiconductor foundry, and Cadence Design Systems, Inc. announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has...

Microelectronics Commons Prototype Giving Much Needed Boost to American Microelectronics Industrial Base

The Office of the Under Secretary of Defense for Research and Engineering has proposed a prototype project to close the gap between microelectronics innovation...

SEMI Wins $1 Million Grant to Create Community College Apprenticeship Program for Microelectronics Industry Workforce Development

SEMI, the global industry association representing the electronics manufacturing and design supply chain, announced that, in partnership with Ignited Education, Foothill College and Krause...

Micross CMS Center of Excellence, Crewe, UK Receives Nadcap Certification

Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is proud...

BAE Systems to advance cutting-edge integrated circuit technology for the space industry

BAE Systems has been selected by the Department of Defense (DoD) to qualify a new generation of integrated circuit technology for use in the...
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