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ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support

ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation...

Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems Ansys announces that Samsung...
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