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Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems Ansys announces that Samsung...

Ansys Power Integrity Signoff Solutions Certified for Samsung’s 2nm Silicon Process Technology

Ansys' collaboration with Samsung Foundry validates industry-leading power integrity solutions for next-generation 2nm process technology Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC...
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