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SLB and Qualcomm Partners to Bring Agentic Edge AI to Remote…
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ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
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June 10, 2026
ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation...
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SLB and Qualcomm Partners to Bring Agentic Edge AI to Remote Energy Infrastructure
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