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Read Magazine’s Weekly Roundup: Discover the Most Recent News Eaton ,Resilient…
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Compact 153-ball FBGA package
compact 153-ball FBGA package
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Teledyne HiRel Semiconductors Launches eMMC 5.1 Module
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August 8, 2025
Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact...
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