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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation ,a leading global semiconductor foundry, and Cadence Design Systems, Inc. announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has...

Deloitte TMT 2022 Predictions: Chip Shortage Continues; AI Regulation Increases; Industry Pushes for Sustainable Smartphones; More Entertainment Choices Equals More Churn

Deloitte today released its Technology, Media & Telecommunications (TMT) 2022 Predictions report, which highlights how worldwide trends in TMT may affect businesses and consumers...
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