Cadence Design Systems, Inc., expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance...
KIOXIA America, Inc., announced sampling1 of the industry’s first2 Universal Flash Storage3 (UFS) Ver. 4.0 embedded flash memory devices3 designed for automotive applications. These new, higher performing devices...
Ansys collaborated with Sony Semiconductor Solutions to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and ADAS. Ansys...
Texas Instruments introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of...
Lattice Semiconductor, the low power programmable leader, announced its optimization of the award-winning general purpose Lattice CertusPro-NX FPGA family for Automotive and extended temperature...
